Used SPEEDFAM 16B #9222300 for sale

SPEEDFAM 16B Wafer Grinding, Lapping & Polishing Equipment is a precision wafer surface grinding system designed to provide the highest level of accuracy and repeatability in wafer grinding, lapping and polishing applications. This unit is capable of performing simultaneous grinding, lapping and polishing operations in a highly automated manner, ensuring that parts are finished to the tightest tolerances. SPEEDFAM 16 B features a reliable belt machine drive that offers maximum torque and power for grinding operations as well as a specialized microprocessor-controlled motion control to ensure high-precision results. 16B also features a high-precision kinematic frame, which minimizes the effects of vibrational and thermal loading, providing greater accuracy for wafer surface grinding and lapping. 16 B offers several features that make it a highly desirable machine for grinding wafer surfaces. The first is its ability to accommodate different sized components, thanks to the tool's fully adjustable wafer-grinding arm and wheel. SPEEDFAM 16B also offers automatic wafer loading and unloading, making it a very efficient process. The asset also features a high resolution CCD camera, which allows for precise wafer location tracking and assured accuracy in polishing operations. Finally, SPEEDFAM 16 B wafer grinding, lapping and polishing model is equipped with a unique designed SPM-TM control equipment. This sophisticated SPM-TM control system is a specially designed, flexible polishing control mechanism that allows for precise motion control of the wafer grinding and lapping operations. The SPM-TM control also allows the grinding arm to be controlled via an external, temperature-controlled heater. This allows for accurate adjustment of the grinding speed during the polishing process. In conclusion, 16B is a highly precise and reliable wafer grinding, lapping and polishing unit that utilizes a sophisticated SPM-TM control machine and features a kinematic frame for accuracy and thermal loading prevention. The tool is capable of perform complex operations with high efficiency and repeatability, making it a must have piece of equipment for any production or research lab involved in wafer surface grinding and polishing operations.