Used SPEEDFAM 16B #9272398 for sale

SPEEDFAM 16B is a state-of-the-art wafer grinding, lapping, and polishing system designed to process various types of wafers. The machine offers a wide range of options to support the production of even the most complex wafer structures. The main components of the system include the wafer grinding chamber, wafer polishing chamber, and a PLC interface for controlling the entire process. For optimal processing, the wafer grinding chamber has three stages of size reduction. First, the wafer is subject to a rough grinding process to reduce surface roughness. This is followed by a fine grinding process to further reduce the surface roughness. The final stage is referred to as the precision grinding process, which is used to achieve the desired shape, size, and surface finishes. The wafer polishing chamber is designed to achieve the highest quality surface finish consistent with the original design and artwork. The wafer is subject to a specialized chemical treatment to remove all surface contaminants and a mechanical polishing process to achieve the desired surface finish. This wafer polishing chamber also has the ability to apply any UV or PVD coatings to the wafer, providing additional surface protection. The machine features a PLC interface for controlling the various aspects of the process. The interface enables process monitoring, data collection, and control of the entire machine operation. The PLC offers fast programming, custom programming and up to 32 programs are available for wafer grinding, polishing and other complex processes. SPEEDFAM 16 B offers superior performance in wafer grinding and polishing processes. Its precision grinding capability ensures that the wafer surface structure closely matches the design requirements. Additionally, the wafer polishing chamber ensures that the wafer surface finishes closely match the design requirements. The PLC interface offers easy control of the entire process with custom programming and fast feedback. With its state-of-the-art components, 16B is an ideal solution for wafer grinding, lapping, and polishing.