Used SPEEDFAM 16B #9276231 for sale

SPEEDFAM 16B is a precision wafer grinding, lapping, and polishing equipment used for creating precision surfaces on silicon wafers and other semiconductor materials. It is ideal for the applications that require high precision and surface quality while preserving the material integrity. SPEEDFAM 16 B system consists of a computer-controlled machine tool and a diamond-enhanced grinding wheel. The machine tool uses a high speed rotation to perform grinding, lapping, and polishing operations on wafers. The grinding wheel is enhanced with diamonds, which enable it to achieve the utmost level of quality and precision. The grinding wheel is also adjustable in order to produce the desired surface profiles. 16B unit is designed to be reliable and robust. Its components are designed to be durable and reliable, with variable speed control and mechanical feed that ensures operations are performed accurately. The machine also features a high-resolution vision tool that allows for precision measurements of the parameters that determine the quality of the finished product. 16 B asset is also designed to be user-friendly and safe. Its control software features an intuitive graphical user interface and comprehensive safety functions which make operating the model straightforward and safe. Additionally, the equipment is equipped with an emergency stop button and a safety switch that automatically shuts off the system in case of emergency. SPEEDFAM 16B is a precision wafer grinding, lapping, and polishing unit capable of producing high-precision and high-quality surfaces on semiconductor materials. Its computer-controlled machine tool and diamond-enhanced grinding wheel deliver maximum accuracy and precision in a reliable and user-friendly environment. Additionally, its high-resolution vision machine enables precise measurement of finish parameters, which leads to accurate and repeatable results.