Used SPEEDFAM 18 DPAW #9208822 for sale

SPEEDFAM 18 DPAW is a state-of-the-art wafer grinding, lapping and polishing equipment. This comprehensive system is designed to provide a high degree of accuracy and reliability to help meet the highest industry standards. It features two work spindles with speeds up to 36,000 rpm, giving it the capability of grinding, lapping, and polishing single- and double-sided wafers in a single operation using three abrasive products. 18 DPAW is also equipped with a stencil printer, allowing for printing character and logo designs directly onto the wafer surface. Additionally, the unit is designed for fast setup and easy operation, making it an ideal choice for production lines. SPEEDFAM 18 DPAW features a dielectric loading platform that helps minimize spindle vibration, resulting in a precise, efficient grinding and polishing process. The front-side grinding-lapping wheel utilizes diamond and piezo-ceramic abrasives, making it ideal for a wide range of substrates. The rear-side polishing wheel is designed to reduce polishing time and enable a higher degree of precision. The machine's nine-stage filter capability reduces airborne particle contamination and ensures a clean working environment. Other features include a PC-based control tool with a 7-inch touch screen, a barcode reader, and a vision inspection asset with image analysis capabilities. 18 DPAW provides a complete set of tools for grinding, lapping and polishing single- and double-sided wafers. This model is capable of processing multiple wafers up to 200 mm in diameter in a single operation with maximum efficiency. Its variable speed spindles allow for a wide range of grinding, lapping, and polishing angles and speeds, making it suitable for a variety of applications. In addition, the equipment is designed for fast mobilization and tear-down, making it a cost-effective solution for production lines. Overall, SPEEDFAM 18 DPAW provides a reliable, cost-effective system for grinding, lapping, and polishing single- and double-sided wafers with maximum efficiency and accuracy. With its advanced features, this unit is ideal for a variety of application and is an important tool in the process of producing high-quality wafers.