Used SPEEDFAM 18 DPAW #9224527 for sale

SPEEDFAM 18 By DPAW is a wafer grinding, lapping and polishing machine. It is comprised of a dynamically balanced, flexible arm grinding system with variable speed motors, and a multi-purpose lapping plate and support assembly. The machine is designed to be used in semiconductor applications. SPEEDFAM allows for an even abrasive wear and a high quality finish on the wafer. The flexible arm grinding system allows for the abrasive wheel to move freely, reducing the risk of damage to the wafer. With the use of multiple motors, the grinding pressure can be regulated to enable a uniform grind and finish on the wafer. The lapping plate is designed to distribute abrasive slurry over the wafer's surface. This allows for an even wear on the wafer during the lapping process and results in a consistent finish. The plate also allows for a great degree of control over the lapping process, giving the user the ability to adjust the speed and intensity of the lapping process. SPEEDFAM 18 has a variety of automation options, including automated loading and unloading of the wafer, in-process monitoring, and feedback systems. This allows for a more efficient and precise process when grinding and polishing wafers. It also reduces the risk of damaging the wafer due to improper handling or improper automation. SPEEDFAM 18 is a reliable and efficient wafer grinding, lapping and polishing machine. Its adjustable grinding pressure, lapping plate, and automation options allow for a precise and consistent finish on the wafer. Furthermore, the machine's design allows for a high degree of operator safety by reducing the risk of damage to the wafer.