Used SPEEDFAM 18 DPAW #9226985 for sale

SPEEDFAM 18 DPAW (Dual Plate Abrasive Wheel) is a wafer grinding, lapping, and polishing equipment designed to facilitate easy and efficient processing of semiconductor wafers. This system has been specifically designed to provide high accuracy and high throughput, enabling the fabrication of complex integrated circuits. The unit utilizes two, double-sided, abrasive platter wheels that provide a precision slicing action. This action allows for highly consistent grinding, lapping, and polishing of semiconductor wafers. 18 DPAW is a compact machine, featuring a 6-axis motion machine and a modifiable cassette tool. The cassette asset allows a range of substrates to be processed without significant machine downtime. Additionally, the model has a high spindle speed of up to 3000 RPM, with high precision accuracy up to 75µin/. A high-performance grinding, lapping, and polishing interface is further integrated into the equipment. The grinding interface is designed to provide true, uniform material removal, while the lapping processes provide a high-quality finish and a good surface finish. SPEEDFAM 18 DPAW further features user-friendly controls, enabling users to modify parameters and settings. Wi-Fi and Ethernet connections are also included, offering local or remote access to control, programming, diagnostics, and other monitoring functions. Operator feedback is further provided through the integrated HMI (Human Machine Interface). The system offers an upgradeable controller, making it easy to maintain unit longevity and performance. 18 DPAW is rated for input voltages of 110 to 220 VAC, with a power consumption of 10 to 20 kW. This machine can be operated in a number of operating temperatures, ranging from 10°C to 35°C. The tool is covered by a one-year warranty and includes an enhanced training program and customer technical support. SPEEDFAM 18 DPAW combines an easy-to-use control asset, high-performance grinding, and lapping interface, and user-friendly parameters to deliver an efficient wafer grinding, lapping, and polishing model. This equipment is ideal for the fabrication of complex integrated circuits, with its high speed, precision, and accuracy.