Used SPEEDFAM 18 DTAW #9087735 for sale

SPEEDFAM 18 DTAW (Dual Table Automated Wafer Grinder, Lapper, and Polisher) equipment is a high-performance wafer grinding, lapping, and polishing system for high-precision applications. The unit has been specially designed to provide efficient automated wafer grinding, lapping, and polishing of high-precision complex semiconductor wafers. The main features of 18 DTAW machine include: 1. A dual table design that allows independent operation of the grinding, lapping, and polishing operations, allowing for improved process throughput and flexibility. 2. A fully-automated control tool with motion control for the grinding, lapping, and polishing functions. 3. A high-precision grinding stage for uniform material removal, along with a reliable lapping and polishing stage for final surface finish. 4. A specialized control asset designed to optimize the process parameters to prevent damage and ensure the highest quality surface finish. 5. Customizable process parameters, such as table speed, grinding depth, abrasive type, and grinding time. 6. An advanced optical model for 3D mapping of the wafer surface. 7. Fully programmable process steps, including in-line measurement of the wafer surface. 8. A safety interlock equipment to protect workers and ensure process safety. SPEEDFAM 18 DTAW system combines all the essential features necessary for precise and efficient grinding, lapping, and polishing of semiconductor wafers to reach the desired surface finish. The unit has been designed with a robust construction and an advanced control machine to provide superior grinding, lapping, and polishing results with low contamination. With the features of 18 DTAW tool, users can be sure to achieve consistent high-quality surface finish with greater throughput and efficiency.