Used SPEEDFAM 18B-4L / 16B-5L #9050539 for sale

SPEEDFAM 18B-4L / 16B-5L
ID: 9050539
Vintage: 1982
Polisher (1) Motor Clutch reverse method 1982 vintage.
SPEEDFAM 18B-4L / 16B-5L Wafer Grinding, Lapping & Polishing Equipment is a highly efficient, versatile and precise machine for the lapping and grinding of a wide range of materials and substrates including semiconductors and integrated circuits. The system offers maximum flexibility with a range of interchangeable grinding/lapping plates and two different specifications (18B-4L or 16B-5L) to accommodate material-specific applications. The 18B-4L model is designed for high precision lapping and polishing of hard materials, while the 16B-5L model is ideal for both soft or hard material polishing. Both models feature a fully enclosed unit to ensure the safe handling of materials and to minimize environmental contamination. The machine is designed with accurate and consistent feed speeds to ensure a uniform material surface. The tool also incorporates a bellows-type dust proof enclosure and an adjustable and accurate pallet feed asset for precise grinding and lapping. 18B-4L / 16B-5L Grinding, Lapping & Polishing Model also includes a number of safety features such as interlocked door and a highly regulated, temperature-controlled coolant supply. The lid of the equipment is sealed, ensuring that the grinding plate is tightly maintained even when the machine is running at high speed. The system is highly compatible and can be used in a variety of applications. It is configured with a range of automated grinding, lapping and polishing processes and is ideal for certified projects. The unit can process a wide range of components, including wafers, flat surfaces and several shapes. SPEEDFAM 18B-4L / 16B-5L is especially suitable for handling ITO, quartz, silicon and diamond finishing processes because of the flatness and the speed of its grinding and polishing disc. It is an ideal solution for processing highly precise components in a multitude of laboratories and industries. With its high-performance and reliable technology, 18B-4L / 16B-5L Wafer Grinding, Lapping & Polishing Machine is a renowned solution for efficient and precise grinding, lapping and polishing applications. It is user-friendly and ensures highly economical operation with minimal maintenance required.
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