Used SPEEDFAM 18B-4L / 16B-5L #9208824 for sale

SPEEDFAM 18B-4L / 16B-5L is a wafer grinding, lapping, and polishing equipment designed for commercial use. It is an advanced system that offers high-precision surface finishing for a variety of applications in the semiconductor industry. This high-performance unit is comprised of multiple components, including grinders, loupes, polishers, buffer blades, and compound plates, all of which are controlled in a fully automated process. The grinding process begins with a high-speed grinding wheel that rotates at up to 4,500 RPM for accurate and efficient removal of excess material from the wafer surface. After grinding, the surface is prepared for lapping, which is performed using an optimized rotating lapping unit that uses diamond pastes and compresses to ensure optimal and consistent wafer surface flatness and parallelism. The lapping process is followed by a specialized polishing machine that has a wide range of settings to enable precise planarizing and surface finishing. This highly precise polishing tool can achieve marginal echelons of up to 0.2μm and surface texture down to 0.052μm (Ra). The asset then uses buffer blades, compound plates, and other specialized tools to produce a highly polished and reflective surface finish. 18B-4L / 16B-5L also offers a variety of advanced features such as customizable process recipes, precise control of grinding, lapping, and polishing times, load monitoring and diagnostic functions, product traceability, and more. These, along with the model's high degree of accuracy and repeatability, makes it a suitable solution for achieving high-quality results for a variety of materials and applications.