Used SPEEDFAM 18B-4P-1M #9212616 for sale

SPEEDFAM 18B-4P-1M is a wafer grinding, lapping & polishing equipment specifically designed to provide precision and accuracy when required. It is an automated, single pass system that is capable of performing flat grinding and polishing operations for wafers up to 18" in size. 18B-4P-1M features a high-speed, 4-axis spindle that allows for quick and accurate grinding and polishing operations. The 4-axis spindle is capable of running at up to 20,000 RPM and provides 0.001" (0.02mm) radial accuracy. SPEEDFAM 18B-4P-1M also features a single-point constant force compensation unit that compensates for the changing cutting forces encountered during the grinding and polishing process. This allows for consistent accuracy and repeatability within the machine. The tool is designed with a "no fuss, no mess" approach that enables quick and easy set up and operation. 18B-4P-1M is a modular asset that consists of two main components; a grinding/polishing head and a robotic controller. The grinding/polishing head includes the four-axis spindle with a hydroplaning platen for uniform flatness, a custom loading robot, and coolant delivery model. The main grinding/polishing head is capable of performing grinding, lapping, and polishing operations on a variety of materials. The robotic controller is used to manage the robotic loading and unloading feature of the grinding/polishing head. SPEEDFAM 18B-4P-1M also features several different types of grinding/polishing media for use with the equipment. The media is designed to provide excellent surface finish and low surface variation on a variety of materials. The grinding/polishing media also provides faster cycle times and helps to reduce clean up time. 18B-4P-1M is also designed to be a user friendly system and includes as standard, a touch-screen user interface and an integrated unit monitoring software package. This monitoring software allows for continuous monitoring of any anomalies in the machine, as well as providing detailed reports on the grinding/polishing process. SPEEDFAM 18B-4P-1M is an automated wafer grinding, lapping, and polishing tool specifically designed to provide precision and accuracy when required. It's modular design makes it easy to set up and operate. The asset includes a high-speed 4-axis spindle, a constant force compensation model, and a wide range of grinding/polishing media for use on different materials. It also comes with an integrated user interface and a equipment monitoring software package that enables users to monitor system performance during the grinding and polishing process.