Used SPEEDFAM 18B-5L #9050540 for sale

SPEEDFAM 18B-5L is a wafer grinding, lapping and polishing equipment designed to suit a wide variety of microelectronic applications. The system is an all-in-one grinding, lapping and polishing machine for wafers of any size. The machine is equipped with a spindle assembly that features an 18B-5L Motor for high-performance lapping in accordance with varying customer requirements. SPEEDFAM 18B-5L Motor is a multi-speed motor for wafer grinding, lapping and polishing applications. The range of speeds achievable with 18B-5L Motor is 1000 to 6000 RPM, which enables the cutting of wafers in a wide range of sizes and ensures the lapping and polishing of wafers to a high degree of finish. The machine comes with a sturdy frame and is fitted with two precision spindles that offer variable speed oscillation from 0.7 to 159 Hz. The spindles enable the sawing, grinding, lapping and polishing of the wafers with a high degree of accuracy and low-cost operation. The sawing process in the unit also uses a V-bracket, allowing for superior accuracy and surface finish in saw steps. The machine is also equipped with an integrated programmable controller that offers automated step controls with a LCD interface that assists in troubleshooting and product tracking. An on-board protection machine is also included to protect the precision spindles from overload or jamming, and a range of additional safety features are built-in to ensure user safety. SPEEDFAM 18B-5L offers superior productivity, reliability, and cost-effectiveness for grinding, lapping and polishing wafers in the microelectronics industry. With its advanced features and superior performance, 18B-5L is ideal for optimizing wafer production processes and improving the quality and performance of finished products.