Used SPEEDFAM 18B-5L #9208825 for sale
URL successfully copied!
ID: 9208825
Vintage: 1983
Double-sided lapper
Pump
Modified carrier
Direct lead
Plate
1983 vintage.
SPEEDFAM 18B-5L is a wafer grinding, lapping and polishing equipment that is designed to produce the highest quality surfaces on a wide range of materials. It can be used for applications such as semiconductor wafer backside grinding, backside lapping and polishing of sapphire substrates, surface finishing of precision optical components, and metal polishing for a variety of industries. 18B-5L is a versatile system that consists of two main components - the Main Unit and the Wafer Grinder - along with a variety of accessories. The Main Unit consists of a multi-position speed controller, digital display for current speed settings, a pump and a filter housing. The Wafer Grinder is a multi-axis robotic unit with five axes of positioning, allowing for accurately controlled grinding and polishing operations. It is equipped with an integrated vacuum machine to ensure adequate part support during grinding and polishing. SPEEDFAM 18B-5L is easy to operate and maintain. It is a modular tool that allows for easy assembly or disassembly into smaller components for transport or storage. The intuitive design of the asset allows for changeover between different size pieces with minimal setup time. 18B-5L utilizes abrasive and polishing mediums to provide the desired surface finishes on a variety of materials. Its high-precision spindle is capable of delivering up to 50,000 RPM, enabling rapid material removal and precise surface finish. The 5 Axis model of the grinder maximizes control and accuracy during machining, and its fine-grain motor provides a smooth start and finish. SPEEDFAM 18B-5L utilizes a number of tools to ensure optimal operation, such as a power monitor, particle counters, thickness gauges, air humidity detectors, and scanning electron microscopes. Additionally, the equipment is compatible with a range of software packages to monitor and control production processes. 18B-5L is a reliable, reliable system that is ideal for use in applications such as semiconductor wafer backside grinding, backside lapping and polishing of sapphire substrates, surface finishing of precision optical components, and metal polishing for a variety of industries. With its versatile design and robust construction, SPEEDFAM 18B-5L is a highly effective and productive unit that can provide the best possible surface finish.
There are no reviews yet