Used SPEEDFAM 18B-5L #9208857 for sale

SPEEDFAM 18B-5L is a state-of-the-art wafer grinding, lapping, and polishing equipment for producing ultra-smooth, precise, and homogeneous surfaces on semiconductor wafers. The system consists of five main components: a belt grinding unit, a planetary grinder, a CMP lapping polisher, a high-precision polishing slider, and a modular automation unit. The belt grinding unit is designed to grind and polish the wafers to a very flat surface prior to processing them in the other units. The unit utilizes an adjustable speed drive to vary the speed of the powered polishing belt depending on the desired results. The belt grinding unit also incorporates a vacuum chamber to capture debris during the grinding process. The planetary grinder is the ideal tool for grinding and lapping wafers. This unit uses a rotating fine diamond abrasive and a polishing pad to create a homogeneous surface on the wafer. The planetary grinder is designed with adjustable speed controls to allow for finer grains to be used for finer finishes. The CMP lapping polisher is designed to achieve very high sub-micron polishing surfaces on wafers. The machine uses a proprietary grinding and polishing process to ensure that a high-quality finish is achieved. The CMP lapping polisher also incorporates a unique water-cooled blocking disc to prevent overheating and ensure that the desired polishing results are achieved. The high-precision polishing slider is designed to provide a high level of accuracy and repeatability when polishing wafers. The tool utilizes pneumatically powered slider arms that move along a fixed track to provide the required polishing force onto the wafer surface. The modular automation asset is designed to interface with the other components of 18B-5L model to allow full automation of wafer processing. This comprehensive automation equipment provides full control over the grinding and polishing process, allowing for optimal results and maximum efficiency. Overall, SPEEDFAM 18B-5L is an advanced, state-of-the-art system for wafer grinding, lapping, and polishing. The unit offers unparalleled accuracy, repeatability, and control, making it the ideal choice for achieving high-quality surfaces on semiconductor wafers.