Used SPEEDFAM 18B-5P #9192805 for sale

SPEEDFAM 18B-5P is a wafer grinding, lapping and polishing equipment. This lapping and polishing system provides a faster and more precise conformal coating of wafers for use in the manufacture of semiconductors and single-piece integrated circuit chips. 18B-5P is composed of three main components: the wafer holder assembly, the media slurry pump, and the lapping/polishing machine. The wafer holder assembly enables secure placement of the wafer on the spindle of the unit. It has a motor that rotates the wafer during lapping and polishing, and provides inductive feedback to detect the rotation speed and frequency. It includes an adjustable speed control that allows the user to set the rotational speed of the wafer. The media slurry pump is incorporated into the machine and connects the slurry supply reservoir to the lapping and polishing machine. The slurry consists of small abrasive particles and an electrolyte to provide effective lapping and polishing of the wafer. The pump's controllable regulating pressure allows for optimal settling of the media slurry on the polishing disc. The lapping and polishing machine has specialized components that ensure the tool is equipped to handle high-precision grinding and lapping of different sizes of wafers. It has a polishing disc and pad that provide a precise conformal coating to the wafer's surface. The polishing disc and polishing pad are hollow bored separators that provide improved cooling of the asset. Additionally, the lapping and polishing machine has a pressure control model that enables users to change the pressure for various applications. Overall, SPEEDFAM 18B-5P lapping and polishing equipment is ideal for semiconductor manufacturing and single-piece integrated circuit chip production. It provides an efficient capability to prepare wafers for die array packaging and other related processes. This system allows for a precise and conformal coating of wafers, and improves production time and cost savings.