Used SPEEDFAM 18B-AW #9120468 for sale

SPEEDFAM 18B-AW is a modern and highly specialized wafer grinding, lapping, and polishing equipment designed for use with technologically advanced materials. The system is capable of producing ultra-smooth wafer surfaces with minimum edge damage, with a tolerance range of <10 nm. The unit is designed to be highly reliable and accurate, reducing downtime and ensuring consistency in processing of advanced materials. SPEEDFAM 18 BAW is a single-head machine developed by SPEEDFAM that offers excellent characteristics such as high linear accuracies and excellent surface roughness. Advanced vibration control ensures that the grinding head maintains a constant distance from the wafer, creating a uniform grinding motion that is stable and reliable. A brushless servo motor controls the grinding head's speed, with pre-set speeds being adjustable to ensure optimal results. A computer-controlled machine monitors all functions of 18B-AW, allowing for accurate timing and adjustments during the manufacturing process. Specialized software processes monitoring parameters from the machine in real-time, providing an effective way of monitoring the grinding and lapping process. In addition, an auto-correction feature is included to improve the accuracy of the grinding, lapping and polishing process. 18 BAW also comes with a safety feature that allows the user to quickly shut off the machine if an error is detected. The user-friendly design also includes built-in on-screen display that allows the user to view a graphical representation of the machine settings and operating parameters. SPEEDFAM 18B-AW also offers several different grinding head sizes, allowing for customizing the machine for specific applications. SPEEDFAM 18 BAW is an ideal solution for production of high-quality advanced materials. It offers a fast and accurate process for achieving a precise and predictable result, making it an attractive choice for the semiconductor and MEMS industrial sectors. The tool's low cost and high accuracy makes it a cost-effective solution for a variety of wafer grinding, lapping, and polishing needs.