Used SPEEDFAM 18B-AW #9208826 for sale

SPEEDFAM 18B-AW is a wafer grinding, lapping, and polishing equipment designed to provide precise product finishes for wafers and other substrates. This system uses both abrasive and non-abrasive techniques to produce perfectly level surfaces on a variety of materials. It is designed for automatic operation, with high-precision adjustable speed control and an over-travel device to prevent over-processing. The machine includes a precision stepped spindle, with separate wafer holders for lapping and polishing. The abrasive parts of the unit include diamond-coated, lap-table spindle and lap-thrust plates. The machine also includes an adjustable-speed, variable-frequency motor, designed to provide high-quality finishes on various substrates. The lap-table is composed of four diamond-coated iron plates, providing a lower surface for the wafer holders on the spindle and an adjustable, metal-backed, lapping table for polishing a variety of wafers. The lapping and polishing table can be adjusted to the right or left to improve the quality of the finished product. SPEEDFAM 18 BAW also features a selection of light and heavy polishing and lapping media for finished surfaces, such as diamond slurries and pastes. This machine includes an over-travel device, to prevent over-processing of the wafers, and is designed to demonstrate repeatable processing results over time. Finally, this tool includes a variety of safety devices, designed to protect both the machine and the operator. These include door interlocks, safety lighting, motion detectors, and emergency stop buttons. Furthermore, the design ensures easy access for maintenance, cleaning, and inspection. Overall, 18B-AW is designed to provide high-precision processing of wafers and other substrates. With variable speed control, a selection of grinding, lapping, and polishing media, and a suite of safety devices, the asset ensures a high-quality end product with minimal risk to both the machine and the operator.