Used SPEEDFAM 18B #293770301 for sale

SPEEDFAM 18B is a highly advanced single-table equipment for grinding and polishing of semiconductor wafers. This high-precision system is designed to produce very high-quality, uniform results on the most challenging materials with the utmost accuracy. 18B is capable of grinding and polishing both uncoated and PECVD coated materials. Its dual-spindle unit allows for complete grinding, lapping and polishing of wafers from one operation. The PI-3 Robot Loader provides advanced automation and convenient access to the machine. The device also features a high-resolution camera and a powerful software package for data acquisition and analysis for detailed results and verification of processes. This tool is also equipped with a unique "Optical Polishing Asset" for improved accuracy of polishing. SPEEDFAM 18B offers an integrated mechanical process chamber, capable of handling variety of wafer sizes from 2- to 8-inches. It is suitable for various materials including wax, resin, glass and metal. The built-in cooling model allows for efficient working conditions, while the advanced water filtration equipment guarantees maximum precision, reliability and cleanliness of the end product. 18B comes with a wide range of abrasive and diamond slurries to process the materials. The automated process control system can be adjusted to different parameters of the abrasive slurry and process parameters. The unit also offers options for automatic grading, trimming and sampling. Overall, SPEEDFAM 18B is a robust and reliable machine to provide industry leading grinding and polishing results. This equipment is capable of delivering perfect performance and achieving high accuracy levels, perfect for the demands of most industry applications. It is a cutting-edge solution for any semiconductor device development and manufacturing process.