Used SPEEDFAM 18B #293778572 for sale

SPEEDFAM 18B is a wafer grinding, lapping, and polishing equipment designed to achieve fine finish, smooth surface finish, and high-accuracy thickness tolerance. This fully automated machine ensures maximum repeatability and consistency of grinding, lapping and polishing. 18B machine is a compact, automated leveling machine which uses a spindle drive system with a 6-axis CNC servo control to provide maximum accuracy for positioning and polishing. The grinding and polishing operations can be easily and accurately controlled using the manually operated touch panel operation. The main components of the unit are a grinding wheel, polishing wheel, and lapping plate. The grinding wheel is equipped with diamond coated abrasives and is used to grind wafers with a thickness range of 0.01mm to 0.2mm. The polishing wheel is used to polish the wafer to a fine finish, while the lapping plate facilitates the lapping process. SPEEDFAM 18B is equipped with an automated chucking and clamping machine to adjust the wafer to the optimal process condition each time. The tool also features an adjustable air-bearing spindle, allowing for accurate depth and speed control during the grinding process. Additionally, the asset features an automatic load optimization model to reduce the cycle time and to ensure repeatability of the results. To help protect the consumer and the environment, 18B is engineered to meet all safety standards, such as EMC and CE specifications and ROHS certification. The equipment is also capable of polishing a variety of wafer types, including silicone, germanium, and Indium, as well as common copper foil preparations. An experienced operator can achieve grinding and polishing with a high accuracy to tolerance, giving users the highest quality results that meet demanding industry standards. SPEEDFAM 18B offers a highly automated process that ensures a high throughput and repeatability of each step, providing an efficient and cost-effective solution for wafer production.