Used SPEEDFAM 18BTAW #9181214 for sale

SPEEDFAM 18BTAW wafer grinding, lapping and polishing equipment is a purpose-built system for the production of precision, high quality silicon and compound semiconductor wafers, substrates, thin-film components and similar components. This unit offers a continuously variable speed drive for speed adjustment from 30 to 70 hertz. It is also equipped with a vibration dampening table for improved surface finish. The machine features dual grinding/lapping applications for the simultaneous preparation of both crystal face and back surface of the wafers. The integrated closed-loop process control tool offers real-time process monitoring and optimization to ensure the best surface quality results. The asset also provides in-situ and post-processing inspection capabilities through its embedded optical microscopy model. SPEEDFAM 18 BTAW equipment utilizes a plunger-style abrasive tool for effective grinding, lapping and polishing. It is equipped with a precision-guided system for precise alignment of the tool and part. The plunger also allows for variable pressure, which allows for the customization and optimization of the polishing process. The unit includes automatic in-process particle detection capabilities, as well as an integrated cleaning machine, for contamination-free processing. The flexible part-handling tool allows for a wide range of parts to be processed and allows for customized fixturing. The asset is designed to be safe and easy to operate, and provides an ergonomic working environment. 18B-TAW model is a fully automated equipment that provides repeatable, high-precision processing for a wide range of small and large parts. Its precise, repeatable process control and automated operation offer improved throughput and the ability to accommodate a variety of materials and applications. Its reliable and dependable design allows for efficient and cost-effective production of high quality precision wafers, substrates, thin-film components and other precision parts.