Used SPEEDFAM 18BTAW #9191608 for sale

SPEEDFAM 18BTAW is an advanced and comprehensive wafer grinding, lapping and polishing equipment designed for high precision semiconductor device manufacture. SPEEDFAM 18 BTAW is designed to improve wafer fabrication speed and quality, reduce costs and generate higher yields in both research and volume production environments. The system makes use of customized grinding stages to mold and shape wafers to precise thickness, surface finish, flatness and uniformity requirements. Diamond and silicon carbide lapping plates impart radial and circumferential grooves on the wafer's surface, providing an ideal smooth and textured finish. Polishing stages in 18B-TAW then utilize a specialized slurrying method to ensure a more consistent and advanced polish. 18 BTAW unit consists of an automated computer controlled operation with a wide variety of options to choose from. The customized operation can be programmed to handle either single wafers or numerous wafers in large batches. The machine also includes various tooling components to customize the wafer grinding, lapping and polishing process. In addition, SPEEDFAM 18B-TAW provides a powerful CCD imaging tool with user-friendly operation that allows technicians to view, analyze, differentiate and adjust parameters during grinding, lapping and polishing processes. The asset is designed for highly-accurate and repeatable results. It provides quick and easy changeover between jobs, as well as the ability to process a variety of wafer sizes and materials. The advanced diagnostics ensure that the grinding, lapping and polishing process is optimized for maximum efficiency. In addition, the model features an interchangeable infeed equipment for easy loading and unloading of wafers. In conclusion, 18BTAW is an advanced and comprehensive wafer grinding, lapping and polishing system designed to improve wafer fabrication speed and quality, reduce costs and generate higher yields in both research and volume production environments. Advanced computer controlled operation, customizable options, powerful CCD imaging unit and an interchangeable infeed machine make SPEEDFAM 18BTAW a reliable and user friendly machine for creating high precision semiconductor devices every time.