Used SPEEDFAM 18BTAW #9191616 for sale

SPEEDFAM 18BTAW is a wafer grinding, lapping, and polishing equipment designed for precision polishing of wafers. The system is designed for low-volume, high-precision, and ultra-precision applications. This unit utilizes a unique combination of lapping and polishing technologies to provide operators with the reproducibility, cleanliness, and flatness requirements demanded by today's critical thin-film technologies. SPEEDFAM 18 BTAW has two integrated grinding/polishing systems. The first machine consists of a two-sided grinding/polishing platen and a three-arm spindle polishing tool. The two-sided platen has an automated bi-directional feed table asset that ensures uniform material removal on both sides of the wafer. The three-arm spindle polishing model is capable of producing fine and ultra-fine polishes. The second equipment consists of a non-contact polisher. This polisher utilizes an RF generator to generate high-frequency AC current for generating a uniform surface finish. The system includes an integrated computerized unit allowing for precise control over the polishing process. This computerized machine includes an interactive menu that allows operators to select desired parameters such as spindle speed, rotational rate, feed rate, and polishing time. The tool also has a monitoring asset for continuous monitoring of the process parameters. The data generated can then be analyzed and the process refined or optimized accordingly. 18B-TAW has a combination of polishing and grinding elements to further ensure a consistent and accurate result. This model has an in-line vacuum equipment to remove any dust or debris during the grinding/polishing process. Furthermore, the Wafer Grinding/Lapping System utilizes an advanced "chip-detection" unit to identify any excessive material removal or process irregularities. 18BTAW can be used for precise finish and mechanically flat wafers with tight tolerances and yields. It is also compatible with numerous types of semiconductor materials such as germanium, silicon nitride, a variety of ceramics, and other metals. 18 BTAW is an advanced and precise wafer grinding, lapping, and polishing machine for precision polishing of wafers. This tool utilizes two integrated grinding/polishing systems, a computerized process control asset, and a combination of polishing and grinding elements to ensure a consistent and accurate result. This model is suitable for achieving ultra-precise finishes with tight tolerances and yields for a variety of semiconductor materials.