Used SPEEDFAM 18BTAW #9257674 for sale

SPEEDFAM 18BTAW Wafer Grinding, Lapping & Polishing equipment is designed for multiple-wafer production applications. Ideal for semiconductor, MEMs, and research and development (R&D) applications, SPEEDFAM 18 BTAW system provides high-quality, precision grinding, lapping and polishing of a variety of wafer sizes. 18B-TAW unit utilizes precision abrasive belts with a patterned surface in order to grind the wafer surfaces. The grinding process removes material quickly and accurately, while regulating the stock removal rate and avoiding material transfer damage to the substrate. Additionally, the machine's automated tool includes a wafer loader that automatically feeds the wafer through the asset for grinding, lapping and polishing operations. The lapping process uses a proprietary flat disk and belt to create an even, highly precise surface finish that is designed to improve the dimensional precision and surface profile of the wafer. 18BTAW's lapping process produces superior planarity andsurface finishes with low surface roughness values. Finally, 18 BTAW includes a polishing stage that uses a different flat disk and belt to produce a smooth, mirror-like finish. The model also includes an in-line metrology station which measures and evaluates the surface roughness of the wafer after each of the grinding, lapping and polishing stages. This feature ensures the profile of the wafer is in compliance with process specifications. To ensure accuracy and repeatability, SPEEDFAM 18B-TAW is equipped with the latest technology for precise positioning of the wafer as it is moved throughout the equipment. The system is also equipped with automated process controls that help optimize the grinding, lapping and polishing process. In sum, SPEEDFAM 18BTAW is a highly accurate and precise wafer grinding, lapping and polishing unit with integrated process controls and metrology. The machine is designed to optimize the grinding, lapping and polishing process for multiple-wafer production applications while also ensuring the wafer surface is consistent and in compliance with customer specifications.