Used SPEEDFAM 20B-5P-II #9007418 for sale

SPEEDFAM 20B-5P-II is an industrial wafer grinding, lapping and polishing equipment suitable for use in semiconductor and other industries requiring fine surface finish and tight tolerances. The system is composed of two main components, the 20B base unit and the 5P lapping/polishing plate. The 20B is an automated, single-axis, double-headed lapping unit designed for wafer grinding and lapping of all types of materials. It features an 18-inch diameter workpiece capacity, a 500-rpm lapping speed, and a 30-minute cycle time. The 5P lapping/polishing plate is made of cerametalite and is attached to the 20B base unit via a precision-ground ball bearing machine. This helps to ensure a smooth running tool with minimal wear. This plate also features a 5-inch workpiece capacity, a variable-speed motor with aspeed range between 0-10,000 RPM, and a recirculating coolant asset for fast and efficient heat dissipation. The combination of the 20B base and the 5P lapping/polishing plate allows for multiple depths of work to be done during the lapping/polishing process. SPEEDFAM 20B-5P II model has an adjustable travel zone that can be adjusted to different depths, allowing for surface finish requirements to be obtained even on samples where the material thickness changes significantly during the process. It also features a wide range of grinding media, offering better control over the polishing process. The equipment's design also features an intelligent safety interlock system for operator safety, as well as a vacuum chamber design that helps reduce particles in the air during processing, improving the overall quality of the end product. 20 B 5 P II unit is an efficient and reliable solution for many industrial grinding, lapping, and polishing needs, from semiconductor wafers to medical components. It is an accurate and durable solution that keeps the costs and cycle times low while still meeting the demands of demanding industries.