Used SPEEDFAM 20B-5P-II #9273208 for sale

SPEEDFAM 20B-5P-II is a wafer grinding, lapping, and polishing equipment designed for precision machine work. This system employs a precise motion control unit that allows accurate positioning of the wafer for grinding, lapping, and polishing. The spindle has a two-stage variable speed from 0 to 5,000 RPM with a maximum spindle power of 5 horse power and is equipped with a servo drive. The table has a movement range of 650 mm x 500 mm and allows for easy alignment of the processed sample. The spindle head contains a double-sided diamond abrasive disk with 2000 facets that can be replaced or changed to fit the materials being processed. The grinding and polishing plate has a multi-axis machine that ensures accurate grinding and polishing of wafer samples. The tool is also equipped with a 20-head supercharge AC servo motor and an adjustable air supply that can be set to the correct pressure for optimal grinding and polishing. SPEEDFAM 20B-5P II asset is suitable for various applications from ultra-thin wafers to large die. This model is also designed for heavy duty and continuous operation with advanced safety features and easy inspectability and repairability. It also provides superior control of size, surface finish, and other parameters while reducing processing time and improving efficiency. 20 B 5 P II equipment is a quality-controlled production system that offers superior accuracies and total control with complete data collected for customizable reports. The unit is supplied with cutting-edge technology and advanced features such as self-diagnosis, temperature monitoring, and dust collection functions. It is also compatible with other systems for efficient integration into existing production lines.