Used SPEEDFAM 20B #9294601 for sale

SPEEDFAM 20B is a wafer grinding, lapping and polishing equipment. This system is designed to increase accuracy and efficiencies in the grinding, lapping and polishing of multiple wafers at the same time. The unit is capable of processing up to 20 wafers at once, with a throughput of up to 5,000 wafers per hour. SPEEDFAM 20 B is composed of two major parts, the grinding unit and the lapping/polishing unit. The grinding unit consists of three stations; the gate station, the coarse grinding station, and the fine grinding station. The gate station serves to open up the wafers for the grinding process. After the initial opening up of the wafers, they move to the two successive grinding stations. Coarse grinding is done using a large grinding stone, while fine grinding occurs with a finer grade grinding stone. During griding, the wafers are passed through an air-film chamber for consistent quality results. The lapping/polishing unit is composed of five stages; preparation, pre-polish, polish, post-polish and inspection. The preparation station is used to flush mounting slurry off of the wafer surfaces prior to the lapping/polishing process. After that, a pre-polish stage is used to reduce the surface roughness of the wafer and to bring it closer to the desired finish. This stage is followed by the polish and post-polish stages, where further surface smoothing is done, and the surface finish is brought to the desired level. Finally, the wafers are inspected to ensure that they meet the requested specifications. 20B is capable of achieving extremely high levels of surface finish, damage, and flatness, all of which exceed the top industry standards. Furthermore, its unique design allows for it to process various wafer sizes, from 75 nanometers up to 500 nanometers. This makes it an ideal choice for many semiconductor manufacturing applications. Additionally, 20 B is a fully automated machine, with an integrated PLC control unit which allows users to set their own processing parameters and monitor the grinding, lapping and polishing processes in real-time. In short, SPEEDFAM 20B is a highly effective wafer grinding, lapping and polishing tool, capable of achieving highly accurate surface finishes, flatness and chip damage. Furthermore, its automated nature and ability to process multiple wafers at once make it a great choice for high volume wafer processing.