Used SPEEDFAM 20B #9294602 for sale

SPEEDFAM 20B Wafer Grinding, Lapping & Polishing Equipment is a high-performance system designed to meet and exceed the industry-standard demands of advanced semiconductor manufacturing requirements. Capable of working with a variety of wafer shapes and sizes, this versatile unit offers reliable grinding, lapping & polishing performance. SPEEDFAM 20 B machine features a rigid, vibration-free base that supports two spindle drives, each driving a diamond lapping disc. The disc and mounting heads are configured for high precision grinding and lapping operations. The diamond lapping discs provide superior cut rates while ensuring a clean, flat finish. The spindle drives are designed to accommodate different lapping disc operations such as a single-side or double-side, plus full stereo lapping. The machine also includes a rotatable jig table that allows the operator to position and hold a workpiece for grinding or lapping. Additionally, an optional cup wheel configuration can be used for polishing operations. For grinding and lapping operations, the tool is capable of providing high levels of accuracy. The diamond lapping disc is capable of providing a finish that is flat to within 5µm for standard workpiece configurations. The asset also features a stroke adjustment model for finer control and adjustment of lapping speeds during operation. 20B equipment is designed with safety in mind. The machine includes several safety features such as automatic emergency stop switches and a rubber guard around the jig table, to alert the operator of potential hazards. In addition, all machine controls feature self-latching components that turn off the machine if the operator's hands stray off the control panel. 20 B wafer grinding, lapping & polishing system is the perfect solution for advanced semiconductor manufacturing requirements. Its combination of high precision, versatile lapping and grinding capabilities, and safety features make it the perfect unit for the job.