Used SPEEDFAM 20B #9377480 for sale

SPEEDFAM 20B equipment is a wafer grinding, lapping and polishing system designed for superior performance and high-quality results with minimal operator intervention. This unit is both robust and user friendly with several key features to improve the overall throughput of the parallel process for multiple wafer diameter and thickness. SPEEDFAM 20 B machine utilizes a three component tool of an integrated controller, precision lapping and stop blocks, and a spindle and grinding wheel motor assembly. The asset controller is equipped with dual high precision microprocessors that independently manage the grinding, lapping, and polishing steps. Additionally, a single phase, full-bridge motor drive incorporated with the model controller can provide up to 1,000 RPM's of precision motor control over the spindle assembly. The precision lapping and polishing blocks within 20B equipment are made from cast steel and provide optimal performance for both thin and thick wafer processing. The lapping and polishing blocks also feature a high degree of flatness and surface finish to ensure consistent, repeatable results. The spindle and grinding wheel motor system contained within 20 B is capable of speeds of up to 2.5 RPS on all four grinding wheels. A low grit diamond coating on the grinding wheels delivers superior grinding performance with very fine control capabilities. The spindle is adjustable to allow for rapid wheel changing with minimal operator intervention. SPEEDFAM 20B unit is also equipped with a gas control machine to ensure a clean working environment for the operator. This tool continuously monitors and adjusts the gas flow rate to optimize lapping and polishing results and ensure the highest level of performance from SPEEDFAM 20 B asset. Overall, 20B is a high performance wafer grinding, lapping and polishing model designed to deliver consistent, repeatable results with minimal operator intervention. Its robust construction and user-friendly features make it an excellent choice for both high and low volume production of a variety of wafer sizes and thicknesses.