Used SPEEDFAM 20B #9377481 for sale

SPEEDFAM 20B is a wafer grinding, lapping, and polishing equipment that provides precise, repeatable and reliable performance of complex multi-step wafer grinding, lapping, and polishing applications. SPEEDFAM 20 B system features a unique combination of speed, accuracy, reliability, and repeatability for a wide range of wafer applications. 20B is a multi-axis unit, capable of performing up to five simultaneous wafer grinding, lapping, and polishing operations. The machine incorporates a high-speed, tunable grinding tool based on the cutting edge Scanning Electron Microscopy (SEM) grinding technology, offering accurate wafer grinding and repetitive precision polishing results. 20 B also features automated lapping and polishing functions for precise fine-tuning of angles and surfaces. Using its advanced closed-loop control asset and a number of precision components, SPEEDFAM 20B can produce a polished surface with superior flatness, texture, and uniformity, enabling the production of extremely accurate products. SPEEDFAM 20 B can also be used to perform various experiments and process verification, as well as edge profiling, hole-tear profiling, and hole-tear detection. The model is equipped with advanced high-speed and low-noise motors, allowing for high-precision and high-speed grinding operations. Additionally, 20B's integrated digital signal processing (DSP) equipment provides a unique signal processing operations to significantly amplify the quality of the grinding and polishing processes. 20 B system has a built-in electrical protection mechanism that ensures a safe and efficient operation of the unit. This is achieved by monitoring the machine's operating status and positioning the wafers for effective performance. All tool components are securely and safely placed in a corrosion inhibited monitoring cabinet. In conclusion, SPEEDFAM 20B is an advanced wafer grinding, lapping and polishing asset that offers precise, repeatable, and reliable performance. With its advanced closed-loop control model, precision components, and automated functions, it is capable of producing highly accurate products and satisfying the most stringent requirements in wafer manufacturing.