Used SPEEDFAM 21B-5P-II #9273127 for sale

SPEEDFAM 21B-5P-II is a wafer grinding, lapping and polishing equipment specifically designed for wafer processing. The system is suitable for various grinding and polishing techniques, ranging from rough grinding to high precision polishing. The unit is equipped with diamond grinding plates and recirculating chillers to reduce heat generation, and includes components and digital control technologies that enable precise control of speed, angle, and pressure to create a smooth, even surface on the processed wafer. The machine is comprised of various components including an acoustic enclosure, a motorized spindle, a precision feeder, a sample holder, a conveying tool, and a grinding and polishing wheel. The acoustic enclosure is designed to minimize noise levels while operating the asset, thus ensuring the user's safety and comfort. The motorized spindle operates at very high speeds and precise angles, allowing for efficient grinding and polishing of the wafer. The precision feeder ensures excellent granularity for grinding and polishing, and works together with the sample holder to precisely control the angle, pressure, and direction of the grinding and polishing movements. The conveying model enables easy transportation of the wafer during the grinding and polishing process. 21B-5P-II equipment offers a wide range of options for grinding and polishing, such as diamond abrasives, alumina abrasives, and ceramics. It also features an automated dampening system for the grinding process that produces a remarkably dust-free environment for maximum safety and cleanliness. Furthermore, the unit is equipped with additional automated components for the accurate read out and programming of grinding/polishing data. SPEEDFAM 21B-5P-II machine provides an excellent performance and is very easy to use. It also offers LCD monitoring with a timer setting and a control features which enable the user to program grinding and polishing cycles to suit individual requirements. It is a great option for anyone looking for a quality, efficient and precise wafer grinding, lapping and polishing tool.