Used SPEEDFAM 21B-5P-II #9273133 for sale

SPEEDFAM 21B-5P-II is a high-capacity, automated grinding, lapping and polishing equipment used in various precision engineering operations. This wafer grinding, lapping and polishing system is designed for lapping both sides of larger grade, Ceria-based substrates. The unit's patented Pump Sump™ design circulates the slurry used for grinding and polishing at low, uniform pressure for consistent results. This machine has a processing area of 21 inches which can handle substrates up to 200 mm Dia and 610 mm L. Its load capacity can vary from 500 lbs. to 2000 lbs., allowing for a wide range of processing applications. The high-speed spindle gives the lapping machine a superior finish, and can also accommodate an optional center hole dilution plate for increased accuracy. The unit's high-efficiency vibration filtration machine provides superior surface finishing with very low particle size distribution. 21B-5P-II has a high-performance dual-zone grinding and lapping head which allows operators to quickly and accurately process each substrate according to its unique grinding, lapping and polishing requirements. This head allows for a maximum speed of 8000 rev/min and adjusts automatically to various applications. The wafer grinding, lapping and polishing tool is built on a heavy-duty frame that is designed to withstand vibration and aids in the removal of particles from the wafer. The asset is equipped with an intuitive control model with a color LCD touch-screen interface. This control equipment provides customized programming for each application as well as automatic and manual control options. SPEEDFAM 21B-5P-II also has an auxiliary station for loading and unloading substrates as well as aluminum oxide abrasive removal. This wafer grinding, lapping and polishing system requires minimal maintenance, and provides clean, dry processing by featuring a combined centrifugal dryer and cyclone separator that separates airborne particles and liquid mist from the air exhausted from the unit. Additionally, the machine is enclosed in a soundproof case creating a quiet working environment. Overall, 21B-5P-II is a highly efficient and reliable wafer grinding, lapping and polishing unit, suitable for processing various substrates with consistent results. This machine is ideal for precision engineers and industries requiring high-precision results.