Used SPEEDFAM 21B-5SSG #9074675 for sale

SPEEDFAM 21B-5SSG is a high-precision wafer grinding, lapping, and polishing equipment designed for the fabrication of semiconductor and optoelectronic components. The system is capable of producing complex and precise surfaces on a variety of materials, including hard brittle and ductile materials. 21B-5SSG grinds, laps, and polishes material to specified optical requirements while ensuring the highest degree of product accuracy. The grinding module, of SPEEDFAM 21B-5SSG, is capable of achieving both surface and size accuracy. The unit employs a horizontal, continuous motion feeder, drive motors and a grinding wheel that can operate at a range of speeds. This feature allows the operator to move the material in a spiral pattern over the grinding wheel. The machine utilizes a computer-controlled, adjustable profiled component to determine the depth, shape, and load necessary to achieve the desired result. The lapping module is powered by an adjustable rotation speed that can be set to meet the needs of the application. The tool is built with an inclined surface to ensure a uniform load over the entire lapping surface. The positioning of the lapping plate ensures that the material is parallel to the plate without causing any small folds or uneven wear during the process. The asset also features a polishing module which is an excellent choice for material that requires a higher level of surface finish and accuracy. 21B-5SSG is equipped with a polishing wheel that operates at a range of speeds to optimize the polishing process. The unit also has the capability to reverse motor direction and allow for uniform material removal, without creating any pits or irregularities. In addition to the grinding, lapping and polishing modules, SPEEDFAM 21B-5SSG also features a variety of diagnostic and safety features. The model offers acoustic emission monitoring, a laser gap control equipment, and a monitoring system for maintaining performance data. The unit is designed with user interface panels to provide an accessible way to adjust and read machine parameters. Furthermore, it is designed with a pass/fail tool that allows operators to quickly identify and isolate component errors for quick and efficient troubleshooting. Overall, 21B-5SSG is an extremely accurate and reliable wafer grinding, lapping and polishing asset. It is designed to fabricate components to precise surface and size requirements while ensuring the highest degree of accuracy. The model also features a variety of advanced features that allow operators to adjust parameters, diagnose faults, and monitor performance data. This ensures that effective component fabrication is not hindered by any mechanical or environmental conditions.