Used SPEEDFAM 22B-5L-II #9105515 for sale

SPEEDFAM 22B-5L-II is a stand-alone, compact wafer grinding, lapping & polishing equipment designed for high precision grinding, lapping and polishing of semiconductor wafers. This versatile system is capable of performing single and double side grinding, lapping and polishing, as well as pre-grinding, super finishing and cleaning operations. The unit is equipped with a constant-speed, direct-drive, high-torque motor which ensures smooth operation and precision accuracy. 22B-5L-II also incorporates a fully automated control machine which incorporates the latest PLC and CNC technology to ensure precise motion control of the grinding, lapping and polishing process. The tool consists of a base-table with drive motor and a wafer clamping mechanism, a wafer grinding, lapping and polishing head, a fluidic-feedback control asset and a force measuring model. The base-table is designed with an ultra-low profile, optimized for minimal floor space. The adjusted position of the grinding and lapping head can reach a minimum distance from the wafer to minimize chip-out. The grinding head has a number of axis for height, tilt and rotation and is mounted on precision counterbalance load cells to ensure optimum grinding forces. The equipment also features a high-precision, fluidic-feedback control system for increased accuracy and repeatability. This automated control unit utilizes the latest PLC and CNC technologies to ensure precise motion control of the grinding, lapping and polishing process. The machine is equipped with multiple safety sensors to ensure safe and reliable operation. SPEEDFAM 22B-5L-II is ideal for precise grinding, lapping and polishing of all types of semiconductor wafers, and offers exceptional speed, accuracy and repeatability. With its automated control tool and precision grinding, lapping and polishing operations, 22B-5L-II is the ideal solution for a wide range of semiconductor wafer applications.