Used SPEEDFAM 22B-5L #9276642 for sale
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ID: 9276642
Double sided lapping system
(3) Motor
Touch panel
Auto thickness control.
SPEEDFAM 22B-5L is a wafer grinding, lapping and polishing equipment designed for precision polishing as well as conditioning and re-shaping of a variety of wafer substrates. It is a versatile system that can handle complex processes from finish grinding, lapping, and polishing a wide range of materials, shapes, sizes, and thicknesses. 22B-5L consists of a number of main elements: a spindle assembly, an abrasive grinding wheel, lapping plates, polishing pads, and sample holders. The main structural component of SPEEDFAM 22B-5L is the spindle assembly, which includes a brushless AC motor mounted in a steel frame that rotates at adjustable speeds between 250 to 10000 RPM. The motor is connected to the abrasive grinding wheel which is enclosed in a protective shield and is located near the sample wafer or holder. Grinding wheel selection includes abrasive resin wheels and diamond wheels. The lapping plates are mounted above the grinding wheel and consist of a fine-grit medium that is abraded against the surface to be polished at variable rate. The polishing pads are mounted on the end of the lapping plate and are used to further finish and refine the surface. The sample holders include pneumatic and manual sample clamps, adjustable fastening pins, and a sample extender rail, enabling accurate and repeatable positioning of a wafer along the working surface. 22B-5L is designed for enhanced safety, with anti-vibration tables for grinding wheel and sample holder, automatic shutdowns in the event of over stressing the unit, and an advanced control machine for precise stepless speed control and automatic compensation for changes in the load. SPEEDFAM 22B-5L provides simplified control panel operation and powerful PC software, allowing for enhanced process monitoring and programmability. The modular design also allows for an upgrade or addition of several options, such as an axis tilt tool, a wafer rotation capability, and a three-axis laser interferometer for asset measurements. 22B-5L is an ideal model for the robust and precise production of diverse high-precision components and wafers, allowing for cleaner, denser surface finishes, faster processing rates, and improved process definition. This equipment is easy to service and to maintain and produces consistent results, making it suitable for both low- and high-volume production.
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