Used SPEEDFAM 22B #293652327 for sale

SPEEDFAM 22B wafer grinding, lapping, and polishing equipment is designed for the grinding, lapping, and polishing of large semiconductor wafers and other fragile components. The system consists of a grinding head, lapping plate, and polishing plate mounted on a heavy-duty steel trolley. The entire unit rides on precision linear-slides and utilizes a powerful motor that is capable of producing speeds up to 10,000 rpm. Furthermore, the unit has a variety of process options that can be programmed to optimize the quality of each wafer or component. The grinding head of 22B is adjustable to a variety of angles, allowing it to grind and shape the surface of the wafer or component with high accuracy. The grinding head is also equipped with a variety of pads and grinding wheels that are necessary for proper grinding of the wafer or component. Furthermore, the grinding head has a cooling machine to regulate the temperature of the grinding head during operation and prevent any damage to the wafer or component. The lapping plate of SPEEDFAM 22B is equipped with a PPS (positioning, polishing, and servicing) module that allows for precise positioning of the lapping plate and accurate polishing of the wafer or component. The lapping plate can be adjusted to a variety of angles, allowing the user to optimize the level of lapping for each wafer or component. Furthermore, the lapping plate has a cooling tool that is designed to maintain the uniform temperature of the lapping plate during the operation. The polishing plate of 22B utilizes a precision micro-shell technology, which allows for fine polishing of the wafer or component. The polishing plate has a number of different polishing heads, which can handle a variety of polishing processes. Furthermore, the polishing plate also has a complex cooling asset that is designed to regulate the temperature of the polishing plate during operation and prevent any damage to the wafer or component. The entire unit is designed with user safety and ease of use in mind. SPEEDFAM 22B is equipped with safety features such as an E-Stop function, a remote PPS safety frame, a safety foot on the grinding head, and a safety interlock switch. Furthermore, the model has a user-friendly interface that allows for easy setup and programming of the equipment. In conclusion, 22B is a powerful and versatile wafer grinding, lapping, and polishing system that provides high accuracy and yields consistent results. The unit is designed with user safety and ease of use in mind and is perfect for large scale production of wafers and other fragile components.