Used SPEEDFAM 24 BTAW #9366022 for sale

ID: 9366022
Lapping machine, 24" Solid plate with polishing pad (4) Retaining rings, 9” Conditioning ring inside diameter: 11 7/8" (4) Pneumatic pressure plate Dispensing system Electrical component Cylinders Control valve Power supply: 220 VAC, 3 Phase.
SPEEDFAM 24BTAW is a state-of-the-art wafer grinding, lapping & polishing equipment designed for the semiconductor industry. The system is designed to provide superior grinding, lapping & polishing over traditional disc grinders with its robust and precise automations. SPEEDFAM 24 BTAW offers superior accuracy and repeatability when grinding, lapping or polishing wafers. It is capable of process repeatability within a few nanometers. This ensures that consistent and uniform results are achieved which in turn reduces process time and increases productivity. This highly sophisticated unit includes a variety of components. The main unit of 24BTAW consists of a heavy-duty anvil plate, precision-ground spindle, X/Y micron table, and heavy-duty Z-axis servo motor. The X/Y table is composed of dynamically balanced, air-bearing linear motion stages and precision-ground motor mounts, providing precise motion control. The Z-axis servo motor features incremental encoding that allows the user to control the height of the wafer. In addition to the main unit, 24 BTAW also includes a diamond grinding cup wheel, a diamond lapping wheel, and a polishing wheel. These tools can be configured in various ways to meet the needs of specific applications. For example, the cup wheel can be used for rough grinding, the lapping wheel for fine grinding, and the polishing wheel for finishing. The machine also features a polishing chamber, which allows users to fully automate the polishing process. SPEEDFAM 24BTAW can also be customised to fit the needs of specific applications. It features integrated security and control systems, which allows the user to adjust the tool settings to meet their needs. The asset can also be set up for manual or remote operation. SPEEDFAM 24 BTAW is a comprehensive wafer grinding, lapping & polishing model that provides precision and repeatability for the semiconductor industry. Its versatile components allow for customisation to suit the needs of each application, and its precise, automated control equipment ensures consistent quality and reduced process time.
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