Used SPEEDFAM 24A6-BA #293609294 for sale

SPEEDFAM 24A6-BA is a precise and highly efficient equipment designed for grinding, lapping, and polishing wafers made from a variety of materials. It's especially ideal for use in the high precision semiconductor industry, where consistency and accuracy are critical for the best results. The major components of 24A6-BA system include the 4-axis digital control table, an integrated automatic loader and unloader, a vertical spindle grinding wheel and a horizontal turntable lapping wheel. The high-speed, computer-controlled motion control table offers staggeringly precise motions and control over the entire process. The integrated automatic loader and unloader ensures efficient automation of wafer movement and easy access to the wafers throughout the polishing process. The high-speed, vertical spindle grinding wheel with its special cooling channels removes wafer surface defects with unrivaled precision. The wheel is outfitted with a robust abrasive spray unit to ensure a consistent finish and maximum life. The horizontal turntable lapping wheel is designed to polish an interface between two opposing surfaces to a fine finish. Its precisely designed lubricant flow & choice of abrasives made to customer specifications make it a highly effective device for wafer surface conditioning. On a higher level, all the features of SPEEDFAM 24A6-BA machine come together to form an intelligent, fail-safe tool that operates in complete precision with speed, safety and accuracy. Its impressive control asset transfers data among process layers quickly and helps globally monitor and debug processes. All the while, the model places industry-leading emphasis on process control and automation to ensure maximum consistency throughout the production process. 24A6-BA is the perfect equipment for the highest level of accuracy and precision in wafer processing, making it a top-of-the-line option for the semiconductor industry.