Used SPEEDFAM 24B #9217162 for sale

SPEEDFAM 24B is a wafer grinding, lapping & polishing equipment designed for the production of precision flat surface parts. It is used to flatten and smooth dielectric and metal surfaces of semiconductor wafers and other delicate components. This system is composed of a top and bottom platen, both of which can accommodate up to 24 wafers. The platen surfaces are made of cast aluminum and coated with ceramic material for optimum performance. The platen top is attached to a geared spindle motor which can move the platen and adjust the pressure required for grinding and polishing. The spindle motor is connected to an integrated control module which allows for the adjustment of the grinding/polishing force. The platen bottom is mounted on linear bearings for precise surface planarity. For wafer grinding, the platen top is fitted with a grinding wheel which can be moved in an up-down motion. The control module allows the operator to select the most suitable grinding pressure, motor torque and abrasive wheel type. Additionally, the control module also allows for the selection of the best possible grinding mode for the wafers' condition. For wafer lapping, the platen bottom is fitted with a fine diamond abrasive silicon carbide paper. The pressure of the silicon carbide paper is adjustable and can be controlled from outside the unit. Moreover, the speed of the platen is adjustable to adjust the lapping pressure. The wafer polishing operation is accomplished by the use of a platen fitted with a rotary brush.The brush is composed of fine diamond grit which is able to polish the surface of the wafers without causing damage. The pressure and speed of the rotary brush can be adjusted to suit the specific polishing requirements. 24B also has two optional accessory modules, an automatic wafer loader and an opto-electronic strip plating machine. The automatic wafer loader allows for faster production processing, while the opto-electronic strip plating tool enables the achievement of uniform plating layers up to a thickness of 0.04mm. In conclusion, SPEEDFAM 24B asset is appropriate for wafer grinding, lapping and polishing due to its versatile design and adjustable features. Its optional accessories allow it to be used more efficiently in the production of precision flat surfaces, making it an ideal choice for a wide range of industrial applications.