Used SPEEDFAM 24BSG #9312404 for sale

SPEEDFAM 24BSG is a wafer grinding, lapping, and polishing equipment designed and manufactured by SPEEDFAM Corporation. This system has earned a reputation for being the world's most advanced grinding and lapping machine line for the semiconductor industry, and is designed to provide efficient and reliable performance for chipmakers. SPEEDFAM 24 BSG unit is capable of grinding, lapping, and polishing both longitudinal and transverse surfaces on wafers up to nine inches in diameter. It features an advanced control machine with easy-to-use graphical user interface, allowing for automated in-process process control and monitoring. This tool also features a programmable logic controller, which allows users to program setup parameters and macros for executing customized processes quickly. 24BSG is powered by an industrial dual-stage turbine air motor asset, capable of achieving high spindle speeds, so the grinding process is accomplished faster than other grinding systems. Thanks to the motor's high torque output, the model can process large, densely-packed wafer surfaces with close tolerances. 24 BSG also offers advanced grinding and lapping mechanics, using linear shanks and fine-toothed cutting surfaces for precise grinding action. In addition, the equipment also offers a unique active gas-jet lapping mechanism, which regulates the flow of the abrasive material in a controlled manner. SPEEDFAM 24BSG is also designed for easy maintenance. It is equipped with an integrated cleaning board, which helps maintain cleanliness inside the grinding chamber, and various tools for cleaning, such as compressed air guns, brushes, trash cans, and vacuum cleaners. The system's parts are also built with F.R.P-coated super-alloy for superior corrosion resistance. Overall, SPEEDFAM 24 BSG is an efficient and reliable wafer grinding, lapping, and polishing unit designed for use in the semiconductor industry. It features a variety of advanced features for fast and accurate wafer grinding, lapping, and polishing, as well as easy maintenance. It offers the highest performance, cleanliness, and precision available in wafer grinding, lapping, and polishing systems today.