Used SPEEDFAM 24BTAW #293636360 for sale

SPEEDFAM 24BTAW is an advanced wafer grinding, lapping and polishing equipment. This system is capable of producing high quality surfaces on a range of wafer substrates. SPEEDFAM 24 BTAW is equipped with up to 24 grinding heads, each capable of controlling both vertical and horizontal feedrates. This allows for very precise control of grinding distances for optimal process accuracy. The 24 grinding heads are organized into three columns and five rows, which are each adjustable in speed and depth according to the specific requirements of the application. The lapping process is controlled by a combination of pneumatic and hydraulic cylinders. This ensures extremely accurate lapping pressure and motion. The pneumatic cylinders allow for fine-tuning of the lapping process while the hydraulic cylinders provide an even and constant lapping pressure. The polishing process is also highly accurate, allowing a wide range of pre-set operating parameters. This ensures accurate and repeatable results. The polishing head is adjustable in both speed and depth, allowing for tightly controlled processes. The unit also supports multiple disc polishing setups for larger workpieces. 24BTAW is constructed of durable components, including a stainless steel body, aluminum cover and reinforced seals. The cover includes multiple windows to easily monitor the process and adjust parameters as needed. The machine is equipped with an intuitive hand-held controller for quick and easy parameter changes. 24 BTAW is an advanced wafer grinding, lapping and polishing tool ideal for high-precision wafer processing. This asset is capable of producing excellent surfaces thanks to its adjustable operating parameters and tough construction. Its ability to handle multiple disc polishing setups makes it suitable for a wide variety of applications.