Used SPEEDFAM 24BTAW #9050556 for sale

SPEEDFAM 24BTAW wafer grinding, lapping & polishing equipment is a versatile, programmable and highly accurate machine. It is designed to accommodate a wide array of cutting, grinding, and polishing needs. The machine provides a wide array of variable speed motors and controls to allow for efficiency and accuracy in the production process. SPEEDFAM 24 BTAW consists of a main base that houses the machine's operational components. The main drive is a 3kW, 18,000rpm DC motor with a VFD, that can provide variable speed to the grinding, lapping and polishing spindles. The grinding, lapping and polishing table assembly is mounted on a heavy duty carousel which allows for retraction and extension of the table to accommodate larger wafers. The carousel also houses an indexer for conveniently changing the spindle speeds depending on the size of the wafer The machine is fitted with a two-stage filtration system which helps in reducing the dirt particles and contamination. It is also equipped with a pneumatic latching unit and a side-mounted grinding wheel change machine, allowing for improved accuracy and convenience. The base unit has a wide range of customizable software options for controlling the grinding, lapping and polishing operations. This includes a high-speed aspheric generator, in-line alignment testing, air-gapped turret, cycle time timer and shot time logger. The software also has an advanced data logging capability, which monitors and records all operations during wafer grinding, lapping and polishing. Comparing to other machines with similar capabilities, 24BTAW wafer grinding, lapping & polishing tool provides a rigid design, an adjustable and extendable work table, and a wide range of added features and good value for money. It is an ideal choice for those requiring an efficient, versatile, and dependable machine for their production requirements.