Used SPEEDFAM 24BTAW #9208828 for sale

SPEEDFAM 24BTAW is an advanced wafer grinding, lapping and polishing equipment. It is designed to facilitate high-precision machining applications of semiconductor material wafers. The system offers an optimal grinding solution with its advanced drive unit, precise adjustment, uniform grinding and safe operation. SPEEDFAM 24 BTAW features a 12-head feeder for high-volume throughput of up to 48 wafers per hour. Its high-speed grinding table ensures that the grinding process is completed quickly while still maintaining accuracy and a consistent finished product. It also includes a double-layer chamber for uniform and superior surface finish. The machine is designed for ease of use. Its powerful Programmable Logic Controller (PLC) allows the operator to easily adjust parameters such as grinding speeds, adjustable grinding pressure, and the number of slice settings. It also features a touch-screen human machine interface (HMI) which provides easy setup and program control and allows for remote monitoring. The tool also includes integrated water and dust management systems to ensure safety and cleanliness during operation. The water management asset filters and recirculates the coolant to prevent pollution in the machining area. The dust management model prevents the spread of airborne particles while controlling temperature and humidity of the working environment. 24BTAW equipment is an ideal choice for grinding, lapping and polishing semiconductor wafers. Its adjustable grinding pressure, high-speed grinding table and double-layer chamber make it a reliable and efficient system for producing high-quality finished products. Its easy setup and program control also enables the operator to quickly set up and adjust parameters for the most efficient process possible.