Used SPEEDFAM 24BTAW #9276630 for sale

SPEEDFAM 24BTAW Wafer Grinding, Lapping & Polishing Equipment is a multi-functional system designed to provide the precision, accuracy, and versatility required for production grinding, lapping and polishing of semiconductor wafers. This unit is equipped with a fully programmable, high performance dry polishing head that can be used for wafer lapping and polishing. This is paired with a high precision machining center to provide precise, accurate grinding of wafers to exact specifications. The machine is powered by a single motor drive with automated speed control of up to 12kW that provides precise control over grinding, lapping and polishing operations. The tool features both separately adjustable axes movements allowing for both precise grinding and lapping operations and the ability to polish all faces of a wafer at the same time. It also offers the ability to profile each face of a wafer at the same time for higher precision and accuracy. SPEEDFAM 24 BTAW is equipped with a graphical CNC user interface for program input and management, allowing operators to program and control the grinding, lapping and polishing process with ease. The asset also allows for full-customization for both wet and dry polishing processes with the ability to adjust the feed rates, tool selection and speed of cutting. Additionally, the model features an integrated in-process monitoring equipment for improved process consistency and data logging functions for process documentation. 24BTAW is designed for productivity and is capable of high throughput for grinding, lapping and polishing of production volume semiconductor wafers. It includes a modular turret system that allows for fast changeover and easy maintenance, improving reliability and decreasing downtime. It also features a range of adjusters to allow for precise and consistent wafer profile adjustment. 24 BTAW is suitable for a variety of wafer production requirements and provides the performance, quality and reliability required for semiconductor wafer production. It is a highly configurable unit, providing a range of options for both wet and dry processes, allowing it to be tailored to meet the specific needs of each customer. This machine is therefore an excellent choice for wafer grinding, lapping and polishing operations that need to achieve high quality and exact specifications.