Used SPEEDFAM 24BTW #9257182 for sale

SPEEDFAM 24BTW is a fully-integrated wafer grinding, lapping and polishing equipment designed specifically for the semiconductor industry. This unit offers a powerful and reliable solution for chip and wafer grinding, lapping, and polishing. The system offers a wide range of capabilities, including grinding from 300nm (0.3 microns) to more than 10mm (0.4 millimeters). It also features a high-speed data acquisition unit that collects and stores data on up to 6,400 individual wafers in memory, so that the grinding and lapping process can be tracked over time. SPEEDFAM 24-BTW features a modular design that allows the user to customize the machine to meet their specific requirements. It can be configured with three different wafer grinding accessories - the Die Grinder, the Wet Grinder and the Disc Grinder - each of which offers a variety of functions, including grinding and polishing. The tool also features a Lapping Accessory Module that allows users to adjust the polishing process for faster and more efficient results. In addition, 24BTW is equipped with a powerful PLC (Programmable Logic Controller) that provides an easy to use, menu-driven interface for programming and executing processes, as well as providing automated data logging and error detection capabilities. The asset utilizes a mono-block platform constructed from high-grade steel alloy for superior rigidity and durability, and is complete with precision-built, state-of-the-art motion components. It features a lightweight, easy to use design and an ergonomic layout that makes it comfortable to operate. 24-BTW also features advanced safety features, including door interlocks and an emergency stop button, that keep the model operating safely and efficiently. SPEEDFAM 24BTW wafer grinding equipment is an ideal solution for chip and wafer grinding, lapping and polishing operations, offering a powerful and reliable solution for your semiconductor production needs.