Used SPEEDFAM 24DAW #9258002 for sale

SPEEDFAM 24DAW is an advanced wafer grinding, lapping and polishing equipment designed to produce near defect-free wafers with specified surface roughness. Its rigid structure and advanced microprocessor-based controls make it suitable for polishing operations requiring highest accuracy and productivity. The system includes an electronically controlled diamond platen grinding head, featuring eight separate diamond pellets arranged in high-precision alignment. This advanced design ensures a consistent grinding surface uniformity throughout the grinding operation. Additionally, the unit enables dual-platen double-sided grinding operations with single-wafer processing, reducing the need for multiple tape changes, which further enhances the overall productivity. Moreover, the machine provides enhanced grinding, lapping and polishing capabilities with advanced ADR (Adaptive Diamond Reduction) control, which helps in maintaining the controlled polishing rate, regardless of the abrasive grain size. It also facilitates grinding to a specific surface roughness by controlling the pressure distribution on the wafer interface. 24DAW is equipped with adjustable power and speed that allows for consistent polishing results on all kinds of wafers ranging from 2" to 8" in diameter. Additionally, it allows for independent and simultaneous rotation adjustment of both the polishing wheels. SPEEDFAM 24DAW is integrated with process monitoring camera tool that adds extra strength to its efficiency by providing real time feedback on the wafer grinding and polishing process. It comes with various safety features such as no-load and current-overload safety trips for grinding motor, dual wheel leakage safety interlock, as well as grinding-wheel and wafer-plate locking asset. In conclusion, 24DAW is an highly efficient and reliable wafer grinding, lapping, and polishing model that is especially designed to achieve highest level of precision and productivity. With its array of unique features, optimal performance, and enhanced safety measure, it is the ideal choice for production of near-defect-free wafers with specified surface roughness.