Used SPEEDFAM 24DTAW #9007419 for sale

SPEEDFAM 24DTAW Wafer Grinding, Lapping, and Polishing Equipment is a multi-functional system designed for efficient, precise, and reliable fabrication of wafers. This unit utilizes precision diamond grinding, lapping, and polishing tools to achieve high tolerance and ultra-smooth finishes as small as five nanometers. The machine is comprised of a CNC grinding head, a 24" servo drive grinding table, and a vacuum clamping bed. Together, these components provide precise, repeatable and reliable grinding, lapping, and polishing of wafers. The CNC grinding head is outfitted with an internal motor and variable-speed adjustment lever. This allows users to precisely control the rate, accuracy, and positioning of the grinding and lapping process. The 24" servo drive grinding table features an integrated slew drive, integral spindle and drive ring, and is capable of bi-directional movement. This movement further allows for repeatable and precise cutting and positioning of the grinding, lapping, and polishing process. 24DTAW also has a vacuum clamping bed to ensure secure and safe fixture of the wafers to the driver table. This ensures consistent cutting force is applied to the wafers, as well as protects the wafers from any damage due to moisture. In order to ensure uniform wafer cut and finish, the tool includes multiple safety features. These include a fully programmable grinding speed, pressure and internal temperature control, a dust seal at the cutting head, and an abrasion prevention asset. This dust seal helps prevent dust and particles from cluttering the working station. The temperature control helps regulate the temperature of the grinding and polishing process, ensuring stability and eliminating any risk of overheating. The abrasion prevention model helps reduce wear on the diamond grinding tools and prevents excessive cutting. Combined, these features make SPEEDFAM 24DTAW an ideal equipment for precise, accurate, and reliable fabrication of wafers with a tolerance as small as five nanometers. With its programmable grinding speed and precise cutting revolution, the system ensures precise and repeatable processing of wafers, making it well-suited for production runs.