Used SPEEDFAM 24DTAW #9007420 for sale

SPEEDFAM 24DTAW is a wafer grinding, lapping and polishing equipment that is designed to provide 20 μm non-directional scratch-free surfaces. The system is designed for the micro-machining of very hard materials such as tungsten carbide, ceramics and composites. It features an automated spindle drive, a servo-driven z-axis, and a variety of processing head configurations. The wafer grinding process is automatically optimized via user input, offering the highest possible level of performance. The unit uses a 24-spindle drive mechanism that provides precise positioning of the grinding wheel, lapping disc, and polishing head relative to the wafer. This ensures accuracy and repeatability in the machining operation. The drive machine also provides high levels of speed and precision to the wafer grinding process. The tool can reach speeds of up to 2000 RPM with a peak torque of 500 km. The asset's servo-driven z-axis ensures accurate, repeatable wafer placement and positioning. The z-axis can be set up to raise and lower the wafer into the grinding, lapping or polishing processes. This is made possible by a precision encoder that reads the motion of the wafer surface and relays the instructions back to the drive controller. The model comes with a wide selection of processing heads that are designed to fit specific wafer sizes and thicknesses. The heads can also be configured to grind, lap or polish different materials and surfaces. This provides the user with a versatile equipment that can be tailored to meet their specific machining needs. 24DTAW boasts a range of user-friendly features that make it easier to use. An integrated interface provides real-time feedback on machinery performance, and a data logging function monitors the entire wafer grinding, lapping and polishing process. In addition, the system also has an in-process diagnostic capability that allows users to diagnose and troubleshoot any unit-related issues. Overall, SPEEDFAM 24DTAW is an advanced wafer grinding, lapping and polishing machine that provides users with the highest available levels of accuracy and repeatability. The tool's modular design makes it easy to configure to specific needs, providing a versatile machining solution for the micro-machining sector.