Used SPEEDFAM 24GPAW #293635730 for sale

ID: 293635730
Vintage: 2000
Single side wafer polisher 2000 vintage.
SPEEDFAM 24GPAW is an effective and efficient equipment for wafer grinding, lapping and polishing. It is designed for grinding, lapping and polishing of semiconductor wafers up to 200mm in diameter, either in a single operation or in a multi-step process. The system is highly automated and includes a unique, integrated automatic wafer handling unit. The grinding, lapping, and polishing process begins with grinding of the wafer surface. This can be done by either an in-situ grinding machine or a standard grinding table. The grinding table is equipped with a high speed rotating grinding wheel that is used to reduce the chip surface. Once the surface is properly chipped, internal honing begins to remove further particle contaminants to improve the surface finish. The internal honing can be done either online or offline and can be adjusted in detail according to the needs of the application. After grinding, the lapping process is used to smooth and refine the surface. Lapping is typically done with a diamond lapping film which is affixed to a flat surface. The wafer is placed on the lapping plate and is subjected to a combination of lubricant, diamond crystals, and air pressure. This process effectively rejuvenates the wafer surface. Once the lapping process is complete, the polishing process is used to reduce surface roughness and remove further particle contaminants from the wafer surface. The polishing process generally utilizes a rotating polishing wheel which is loaded with a abrasive compound. This compound is then subjected to pressure and mechanical action, resulting in a smooth, low-scratch finish. The process is further optimized by the SPEEDFAM ultrasonic assisted polishing technology, which improves the success rate of polishing process. SPEEDFAM 24 GPAW is an effective, efficient, and automated tool that combines grinding, lapping, and polishing processes into one single unit. This helps to make the process more reliable and improves the accuracy and quality of the finished wafer. It is an ideal asset for any wafer production line.
There are no reviews yet