Used SPEEDFAM 24GPAW #9031429 for sale

SPEEDFAM 24GPAW is a wafer grinding, lapping, and polishing equipment designed to create a highly effective, reliable surface treatment process. This system incorporates advanced technologies such as high-precision automatic loading and unloading, multiple tool capability, and a precise monitoring unit. The machine can process a wide range of wafer and substrate materials, including quartz, oxide glass, silicon, galssware, and sapphire. This machine is driven by a powerful AC servo motor to ensure high precision cutting. The drive tool is designed to provide excellent performance, stability, and reliability. It also includes a wide range of automation features, including a wide range of automatic loading and unloading configurations. SPEEDFAM 24 GPAW also offers a variety of application specific parameter settings for a wide range of substrates. This asset has a stainless steel structural base with a dust protection canopy cover. It utilizes a high precision spindle assembly for precise grinding and lapping operations. The spindle is equipped with a speed control feature. Additionally, the grinding and lapping tools are adjustable for various material removal characteristics. For polishing, this model utilizes a high-speed linear motor to provide superior results. It also provides a powerful spindle motor for a maximum of outputs that reduce polishing time. This equipment is also equipped with various safety features, including a self-diagnostics module and an overload protection system. 24GPAW wafer grinding, lapping, and polishing unit is designed to provide highly accurate, consistent, and reliable results. It has a wide range of customizable settings that allow for superior surface treatments and optimized production rates. This machine is suitable for various industries, including aerospace, research laboratories, and universities.