Used SPEEDFAM 24GPAW #9219924 for sale

SPEEDFAM 24GPAW is a high-performance wafer grinding, lapping and polishing equipment designed for the most demanding semiconductor device fabrication requirements. Featuring an array of innovative design features, SPEEDFAM 24 GPAW is engineered to deliver cost-effective material removal and superior surface finishes for a wide range of device sizes and applications. Designed for easy operation and fast setup, 24GPAW provides the flexibility and performance required for optimum device fabrication. 24 GPAW features a compact footprint and ergonomic design that helps maximize productivity and increase machine uptime. Integrated with precision grinding, lapping and polishing technology, SPEEDFAM 24GPAW offers superior accuracy and surface finish making it an ideal solution for multi-functional fabrication operations. SPEEDFAM 24 GPAW features comprehensive grinding, lapping and polishing capabilities. To extract material efficiently, a patented combination of diamond and cBN grinding wheels maximize the material removal rate while maintaining superior surface finish. The integrated lapping capabilities on 24GPAW allow for the control of burr and surface uniformity of the device. The integrated polishing system enables a smooth, blemish-free surface to achieve critical final inspection standards. Equipped with a flexible control unit, 24 GPAW helps maximize the flow efficiencies of semiconductor fabrication. It provides comprehensive part tracing, process verification, and sensor feedback to ensure that all materials are processed accurately. Additionally, operators can easily customize settings in order to produce the highest quality parts for the most demanding applications. SPEEDFAM 24GPAW is designed for maximum safety, durability and low maintenance. Featuring a patented Helios safeguard machine, SPEEDFAM 24 GPAW prevents hazardous spatter created from fragmenting materials during the process. The machine's robust build ensures uncompromised performance and extended operational life. 24GPAW is also equipped with automated maintenance features that seamlessly detect and alert operators of any issues that may arise, reducing downtime and ensuring smooth, uninterrupted production. Overall, 24 GPAW is the ideal choice for the highest performance wafer grinding, lapping and polishing operations. With its precise grinding and lapping capabilities, comprehensive process monitoring, and intelligent maintenance features, the24GPAW offers unparalleled process control, superior surface finishes and maximum productivity.