Used SPEEDFAM 24GPAW #9223158 for sale

SPEEDFAM 24GPAW is a state-of-the-art wafer grinding, lapping, and polishing equipment that can handle a variety of wafer and substrate materials. It can be used for a variety of processes such as surface preparation, planarization, Edge profiling, and thin-film removal. It is a full automated system that has been designed to deliver consistent, high-quality outputs. The unit is powered by a technologically advanced three-axis CNC grinding spindle with a maximum speed of 24,000 revolutions per minute. This spindle is complemented by a choice of diamond, abrasive, and/or resin-bonded tools for precision grinding and lapping of a variety of materials. The machine also comes with a variable speed lapping plate and fine particle slurry tool for achieving very precise grain uniformly distributed across the working surface. The operator is able to monitor all process parameters using the intuitive control panel including grinding pressure, spindle speed, tool wear, and slurry flow rate. This panel also allows easy programming of grinding cycles, allowing for even more consistency and precision in each process. To ensure the best quality and uniformity of the final results, the asset is equipped with a sophisticated surface imaging model. This equipment is able to analyze, detect, and display surface irregularities and other features. It is also possible to save images and analyze them afterwards to check for defects and irregularities. SPEEDFAM 24 GPAW boasts a variety of safety features including sensors that can detect any entry of foreign objects and obstruction of the working area. The sensors can also detect any vibration, which is important for the consistent operation of the system. Overall, 24GPAW is an advanced wafer grinding, lapping, and polishing unit that offers reliable quality outputs. Its intuitive controls and automated features make it easy to use and ensure accurate results can be achieved with minimal setup. 24 GPAW is the perfect tool for manufacturers that are looking for precise surface preparation results.